Cirrus-logic CS42L73 User Manual Page 135

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DS882F1 135
CS42L73
10.PACKAGE DIMENSIONS
10.1 WLCSP Package
64-Ball WLCSP (3.44 x 3.44 mm Body) Package Drawing
Table 17. WLCSP Package Dimensions
Dimension
Millimeters
A 0.450 0.505 0.560
A1 0.170 0.200 0.230
A2 0.280 0.305 0.330
M BSC 2.800 BSC
N BSC 2.800 BSC
b 0.230 0.260 0.290
c REF 0.320 REF
d REF 0.320 REF
e BSC 0.400 BSC
X 3.415 3.440 3.465
Y 3.415 3.440 3.465
ccc = 0.05
ddd = 0.15
Note: Controlling dimension is millimeters.
e
A2
Ball A1
Location
Indicator
X
Y
BUMP SIDESIDE VIEW
A1
b
N
M
d
c
WAFER BACK SIDE
Location Indicator
(Seen Through Package)
Ball A 1
A
e
Seating plane
X
Z
Y
Notes:
Dimensioning and tolerances per ASME Y 14.5M–1994.
The Ball A1 position indicator is for illustration purposes only and may not be to scale.
Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating
plane Datum Z.
øb
Øddd Z X Y
Øccc Z
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