Cirrus-logic CS2300-OTP User Manual download pdf (Page 24)

CS2300-OTP

24 DS844F2

9. PACKAGE DIMENSIONS

Notes: 1. Reference document: JEDEC MO-187

2. D does not include mold flash or protrusions which is 0.15 mm max. per side.

3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.

4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.

5. Exceptions to JEDEC dimension.

THERMAL CHARACTERISTICS

INCHES MILLIMETERS NOTE

DIM MIN NOM MAX MIN NOM MAX

A -- -- 0.0433 -- -- 1.10

A1 0 -- 0.0059 0 -- 0.15

A2 0.0295 -- 0.0374 0.75 -- 0.95

b 0.0059 -- 0.0118 0.15 -- 0.30 4, 5

c 0.0031 -- 0.0091 0.08 -- 0.23

D -- 0.1181 BSC -- -- 3.00 BSC -- 2

E -- 0.1929 BSC -- -- 4.90 BSC --

E1 -- 0.1181 BSC -- -- 3.00 BSC -- 3

e -- 0.0197 BSC -- -- 0.50 BSC --

L 0.0157 0.0236 0.0315 0.40 0.60 0.80

L1 -- 0.0374 REF -- -- 0.95 REF --

Parameter Symbol Min Typ Max Units

Junction to Ambient Thermal Impedance JEDEC 2-Layer

JEDEC 4-Layer

170

100

°C/W

10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1)

SEATING

PLANE

SIDE VIEW

END VIEW

TOP VIEW

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Cirrus-logic CS2300-OTP User Manual Page 24